Journal Articles
Numerical Simulations of Space Charge Waves Amplification Using Negative Differential Conductance in Strained Si/SiGe at 4.2K Journal Article
In: Crystals, vol. 13, iss. 9, no. 1398, pp. 1-11, 2023.
A Theoretical Study of Armchair Antimonene Nanoribbons in the Presence of Uniaxial Strain Based on First-Principles Calculations Journal Article
In: ACS Applied Electronic Materials, vol. 5, iss. 8, pp. 4514–4522, 2023.
In: ECS Journal of Solid State Science and Technology, vol. 12, no. 076014, pp. 1-13, 2023.
The role of Thermalisation in the Cooling Dynamics of Hot Carrier Solar Cells Journal Article
In: Solar RRL, vol. 7, iss. 13, no. 2300140, pp. 1-9, 2023.
Effect of Mask Geometry Variation on Plasma Etching Profiles Journal Article
In: Micromachines, vol. 14, iss. 3, no. 665, pp. 1-16, 2023, (Invited).
Modeling Non-Ideal Conformality during Atomic Layer Deposition in High Aspect Ratio Structures Journal Article
In: Solid-State Electronics, vol. 201, no. 108584, 2023.
DTCO Flow for Air Spacer Generation and its Impact on Power and Performance at N7 Journal Article
In: Solid-State Electronics, vol. 199, no. 108527, 2023.
Application of Two-Dimensional Materials towards CMOS-Integrated Gas Sensors Journal Article
In: Nanomaterials, vol. 12, iss. 20, no. 3651-1--3651-60, 2022, (Invited).
Improving stability in two-dimensional transistors with amorphous gate oxides by Fermi-level tuning Journal Article
In: Nature Electronics, vol. 5, pp. 356–366, 2022.
Editorial for the Special Issue on Miniaturized Transistors, Volume II Journal Article
In: Micromachines, vol. 13, iss. 4, pp. 603-1–603-4, 2022.
Impact of Plasma Induced Damage on the Fabrication of 3D NAND Flash Memory Journal Article
In: Solid-State Electronics, vol. 192, pp. 108261-1–108261-9, 2022, (invited).
Perspective of 2D Integrated Electronic Circuits: Scientific Pipe Dream or Disruptive Technology? Journal Article
In: Advanced Materials, vol. Early View, pp. 2201082-1–2201082-23, 2022, (invited).
Superior Sensitivity and Optical Response of Blue Phosphorene and Its Doped Systems for Gas Sensing Applications Journal Article
In: ACS Omega, vol. 6, no. 29, pp. 18770–18781, 2021.
Theoretical Examination of Thermo-Migration in Novel Platinum Microheaters Journal Article
In: Microelectronics Reliability, vol. 123, pp. 114219-1–114219-14, 2021.
Microstructure and Granularity Effects in Electromigration Journal Article
In: IEEE Journal of the Electron Devices Society, vol. 9, pp. 476–483, 2021, (invited).
Geometric Advection and Its Application in the Emulation of High Aspect Ratio Structures Journal Article
In: Computer Methods in Applied Mechanics and Engineering, vol. 386, pp. 114196-1–114196-22, 2021.
A Method for Simulating the Influence of Grain Boundaries and Material Interfaces on Electromigration Journal Article
In: Microelectronics Reliability, vol. 97, pp. 38–52, 2019.
Thermo-Electro-Mechanical Simulation of Semiconductor Metal Oxide Gas Sensors Journal Article
In: Materials, vol. 12, no. 15, pp. 2410-1–2410-37, 2019, (invited).
Improved Sensing Capability of Integrated Semiconducting Metal Oxide Gas Sensor Devices Journal Article
In: Sensors, vol. 19, no. 2, pp. 374-1–374-14, 2019.
Editorial for the Special Issue on Miniaturized Transistors Journal Article
In: Micromachines, vol. 10, no. 5, pp. 1–3, 2019.
Review-System-on-Chip SMO Gas Sensor Integration in Advanced CMOS Technology Journal Article
In: Journal of the Electrochemical Society, vol. 165, no. 16, pp. 862–879, 2018.
Modeling of Gate Stack Patterning for Advanced Technology Nodes: A Review Journal Article
In: Micromachines, vol. 9, no. 12, pp. 631-1–631-31, 2018, (invited).
Modeling and Simulation of Novel Semiconducting Metal Oxide Gas Sensors for Wearable Devices Journal Article
In: IEEE Sensors Journal, vol. 18, no. 5, pp. 1960–1970, 2018.
Electro-Thermal Simulation & Characterization of a Microheater for SMO Gas Sensors Journal Article
In: Journal Of Microelectromechanical Systems, vol. 27, no. 3, pp. 529–537, 2018.
Framework to Model Neutral Particle Flux in Convex High Aspect Ratio Structures using One-Dimensional Radiosity Journal Article
In: Solid-State Electronics, vol. 128, no. 2, pp. 141–147, 2017, (invited).
Stress Considerations for System-on-Chip Gas Sensor Integration in CMOS Technology Journal Article
In: IEEE Transactions on Device and Materials Reliability, vol. 16, no. 4, pp. 483–495, 2016.
Stress in Three-Dimensionally Integrated Sensor Systems Journal Article
In: Microelectronics Reliability, vol. 61, pp. 3–10, 2016.
In: Microelectronic Engineering, vol. 137, pp. 141–145, 2015.
Performance and Stress Analysis of Metal Oxide Films for CMOS-Integrated Gas Sensors Journal Article
In: Sensors, vol. 15, no. 4, pp. 7206–7227, 2015.
Intrinsic Stress Analysis of Tungsten-Lined Open TSVs Journal Article
In: Microelectronics Reliability, vol. 55, no. 9-10, pp. 1843–1848, 2015.
The Effects of Etching and Deposition on the Performance and Stress Evolution of Open Through Silicon Vias Journal Article
In: Microelectronics Reliability, vol. 54, no. 9-10, pp. 1953–1958, 2014.
Methods of Simulating Thin Film Deposition Using Spray Pyrolysis Techniques Journal Article
In: Microelectronic Engineering, vol. 117, pp. 57–66, 2014.
Modeling the Growth of Tin Dioxide using Spray Pyrolysis Deposition for Gas Sensor Applications Journal Article
In: IEEE Transactions on Semiconductor Manufacturing, vol. 27, no. 2, pp. 269–277, 2014.
A Method for Simulating Atomic Force Microscope Nanolithography in the Level Set Framework Journal Article
In: Microelectronic Engineering, vol. 107, pp. 23–32, 2013.
A Method for Simulating Spray Pyrolysis Deposition in the Level Set Framework Journal Article
In: Engineering Letters, vol. 21, no. 4, pp. 224–240, 2013, (invited).
Modeling the Impact of Incomplete Conformality during Atomic Layer Processing Journal Article Forthcoming
In: Solid-State Electronics, Forthcoming, (Invited, Submitted).
Books
Miniaturized Transistors, Volume II Book
MDPI, 2022, ISBN: 978-3-0365-4169-3.
MDPI, 2019, ISBN: 978-3-03921-010-7.
Incollections
Electro-Thermo-Mechanical Simulation of Semiconductor Metal Oxide Gas Sensors Incollection
In: M. Iqubal Khan (Ed.): Prime Archives in Material Science, vol. 3, pp. 1–38, Vide Leaf, 2021, ISBN: 978-81-953047-9-0, (invited).
Impact of High-Aspect-Ratio Etching Damage on Selective Epitaxial Silicon Growth in 3D NAND Flash Memory Incollection
In: Bogdan Cretu (Ed.): Proceedings of the 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), pp. 1–4, IEEE, 2021, ISBN: 978-1-6654-3745-5.
Electro-Thermal-Mechanical Modeling of Gas Sensor Hotplates Incollection
In: Willem Dirk Driel; Oliver Pyper; Cornelia Schumann (Ed.): Sensor Systems Simulations, pp. 17–72, Springer International Publishing, 2020, ISBN: 978-3-030-16577-2.
Modeling of Gate Stack Patterning for Advanced Technology Nodes: A Review Incollection
In: Lado Filipovic; Tibor Grasser (Ed.): Miniaturized Transistors, pp. 105–135, MDPI, 2019, ISBN: 978-3-03921-010-7, (invited).
System-on-Chip Sensor Integration in Advanced CMOS Technology Incollection
In: J. A. Martino; J. -P. Raskin; Siegfried Selberherr; H. Ishii; Francisco Gamiz; B. -Y. Nguyen; A. Yoshino (Ed.): Advanced CMOS-Compatible Semiconductor Devices 18, Vol. 85, No. 8, pp. 151–162, ECS Transactions, 2018, ISBN: 978-1-62332-488-9, (invited).
Unified Feature Scale Model for Etching in SF6 and Cl Plasma Chemistries Incollection
In: Francisco Gamiz; Viktor Sverdlov; Carlos Sampedro; Luca Donetti (Ed.): Proceedings of the 2018 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), pp. 177–180, IEEE, 2018, ISBN: 978-1-5386-4812-4.
Using One-Dimensional Radiosity to Model Neutral Particle Flux in High Aspect Ratio Holes Incollection
In: Viktor Sverdlov; Siegfried Selberherr (Ed.): Proceedings of the 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), pp. 120–123, IEEE, 2016, ISBN: 978-1-4673-8608-1.
Stress Considerations in Thin Films for CMOS-Integrated Gas Sensors Incollection
In: Y. Omura; J. A. Martino; J. -P. Raskin; Siegfried Selberherr; H. Ishii; Francisco Gamiz; B. -Y. Nguyen (Ed.): Advanced CMOS-Compatible Semiconductor Devices 17, Vol.66, No.5, pp. 243–250, ECS Transactions, 2015, ISBN: 978-1-62332-238-0.
Modeling and Analysis of Spray Pyrolysis Deposited SnO2 Films for Gas Sensors Incollection
In: Gi-Chul Yang; Sio-Long Ao; Len Gelman (Ed.): Transactions on Engineering Technologies, pp. 295–310, Springer, 2014, ISBN: 978-94-017-8831-1.
A Monte Carlo Simulator for Non-contact Mode Atomic Force Microscopy Incollection
In: Ivan Lirkov; S. Margenov; J. Wasniewski (Ed.): Large-Scale Scientific Computing, Lecture Notes in Computer Science, vol. 7116, pp. 447–454, Springer Berlin Heidelberg, 2012, ISBN: 978-3-642-29842-4.
A Two-Dimensional Lorentzian Distribution for an Atomic Force Microscopy Simulator Incollection
In: K. K. Sabelfeld; Ivan Dimov (Ed.): Monte Carlo Methods and Applications, pp. 97–104, De Gruyter, 2012, ISBN: 978-3-11-029347-0.
Towards a Free Open Source Process and Device Simulation Framework Incollection
In: The 15th International Workshop on Computational Electronics (IWCE), pp. 1–4, IEEE Xplore, 2012, ISBN: 978-1-4673-0705-5.
Inproceedings
Process Simulation in Micro- and Nano-electronics Inproceedings
In: IWCN - International Workshop on Computational Nanotechnology (2023), pp. 38-39, 2023, (Invited).
Reliability of Platinum Microheater Geometries for MEMS-Based Gas Sensors Inproceedings
In: Proceedings of the IEEE International Integrated Reliability Workshop (IIRW), pp. 1-6, IEEE, 2023, (International Integrated Reliability Workshop (IIRW), Fallen Leaf Lake, California (USA); 2022-10-09 -- 2022-10-13).
Modeling Plasma-Induced Damage During the Dry Etching of Silicon Inproceedings
In: Proceedings of the IEEE International Integrated Reliability Workshop (IIRW), pp. 1-5, IEEE, 2023, (International Integrated Reliability Workshop (IIRW), Fallen Leaf Lake, California (USA); 2022-10-09 -- 2022-10-13).
ViennaEMC: A Broadly-Applicable Ensemble Monte Carlo Framework Inproceedings
In: Abstract Booklet of the Workshop on Monte Carlo Simulation: Beyond Moore’s Law at the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 1, 2022, (Workshop on Monte Carlo Simulation: Beyond Moore’s Law at the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Granada, Spain; 2022-09-05).
DTCO Flow for Air Spacer Generation and its Impact on Power and Performance at N7 Inproceedings
In: Abstract Booklet of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 34-35, 2022, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Granada, Spain; 2022-09-06 -- 2022-09-08).
Modeling Non-Ideal Conformality during Atomic Layer Deposition in High Aspect Ratio Structures Inproceedings
In: Abstract Booklet of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 32-33, 2022, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Granada, Spain; 2022-09-06 -- 2022-09-08).
Study of Phonon-limited Electron Transport in Monolayer MoS2 Inproceedings
In: Proceedings of the International Conference on Microelectronic Devices and Technologies (MicDAT), pp. 74-78, 2022, (International Conference on Microelectronic Devices and Technologies (MicDAT), Corfu, Greece; 2022-09-21 -- 2022-09-23).
Impact of Mask Tapering on SF6/O2 Plasma Etching Inproceedings
In: Proceedings of the International Conference on Microelectronic Devices and Technologies (MicDAT), pp. 91-94, 2022, (International Conference on Microelectronic Devices and Technologies (MicDAT), Corfu, Greece; 2022-09-21 -- 2022-09-23).
Reliability and Stability of MEMS Microheaters for Gas Sensors Inproceedings
In: Proceedings of the IEEE International Integrated Reliability Workshop (IIRW), pp. 1-10, 2021, (International Integrated Reliability Workshop (IIRW), Fallen Leaf Lake, California (USA) - virtual; 2021-10-04 -- 2021-10-28).
Fast Model for Deposition in Trenches using Geometric Advection Inproceedings
In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 224–228, 2021, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Dallas, Texas (USA); 2021-09-27 -- 2021-09-29).
Combined Process Simulation and Emulation of an SRAM Cell of the 5nm Technology Node Inproceedings
In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 23–27, 2021, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Dallas, Texas (USA); 2021-09-27 -- 2021-09-29).
Gas Sensing with Two-Dimensional Materials Beyond Graphene Inproceedings
In: Proceedings of the International Conference on Microelectronics (MIEL), pp. 29–36, 2021, ISBN: 978-1-6654-4526-9, (invited; International Conference on Microelectronics (MIEL), Nis, Serbia; 2021-09-12 -- 2021-09-14).
Impact of High-Aspect-Ratio Etching Damage on Selective Epitaxial Silicon Growth in 3D NAND Flash Memory Inproceedings
In: Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), pp. 34–35, 2021, (Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Caen, France; 2021-09-01 -- 2021-09-03).
Modeling and Simulation of ALD in a Level Set Framework Inproceedings
In: Proceedings of the EFDS Workshop on Simulation for ALD, pp. 9, 2021, (invited; EFDS Workshop on Simulation for ALD, virtual; 2021-03-25).
Electromigration Model for Platinum Hotplates Inproceedings
In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 315–318, 2020, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kobe, Japan - virtual; 2020-09-23 -- 2020-10-06).
Geometric Advection Algorithm for Process Emulation Inproceedings
In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 59–62, 2020, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kobe, Japan - virtual; 2020-09-23 -- 2020-10-06).
Integration of Gas Sensors with CMOS Technology Inproceedings
In: Proceedings of the IEEE Electron Devices Technology and Manufacturing Conference (EDTM), pp. 294–297, 2020, ISBN: 978-1-7281-2539-8, (invited; IEEE Electron Devices Technology and Manufacturing Conference (EDTM), Penang, Malaysia - virtual; 2020-03-16 -- 2020-03-18).
Granularity Effects in Electromigration Inproceedings
In: Proceedings of the IEEE Latin America Electron Devices Conference (LAEDC), 2020, ISBN: 978-1-7281-1044-8, (invited; IEEE Latin America Electron Devices Conference (LAEDC), San Jose, Costa Rica; 2020-02-25 -- 2020-02-28).
CMOS-Compatible Gas Sensors Inproceedings
In: Proceedings of the International Conference on Microelectronics (MIEL), pp. 9–16, 2019, (invited; International Conference on Microelectronics (MIEL), Nis, Serbia; 2019-09-16 -- 2019-09-18).
Modeling and Simulation of Atomic Layer Deposition Inproceedings
In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 323–326, 2019, ISBN: 978-1-7281-0938-1, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Udine, Italy; 2019-09-04 -- 2019-09-06).
Process Simulation in the Browser: Porting ViennaTS using WebAssembly Inproceedings
In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 339–342, 2019, ISBN: 978-1-7281-0938-1, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Udine, Italy; 2019-09-04 -- 2019-09-06).
Electromigration in Nano-Interconnects Inproceedings
In: Book of Abstracts of the Workshop on High Performance TCAD (WHPTCAD), pp. 2, 2019, (invited; Workshop on High Performance TCAD (WHPTCAD), Chicago, IL, USA; 2019-05-24 -- 2019-05-25).
Fast Volume Evaluation on Sparse Level Sets Inproceedings
In: Book of Abstracts of the International Workshop on Computational Nanotechnology (IWCN), pp. 113–114, 2019, ISBN: 978-3-9504738-0-3, (International Workshop on Computational Nanotechnology (IWCN), Chicago, IL, USA; 2019-05-20 -- 2019-05-24).
CMOS Compatible Gas Sensors Inproceedings
In: Book of Abstracts of the International Conference on Materials Science and Engineering, 2019, (invited; International Conference on Materials Science and Engineering, San Francisco, CA, USA; 2019-02-18 -- 2019-02-20).
Modeling the Influence of Grains and Material Interfaces on Electromigration Inproceedings
In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 83–87, 2018, ISBN: 978-1-5386-6788-0, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Austin, Texas, USA; 2018-09-24 -- 2018-09-26).
Enhanced Sensing Performance of Integrated Gas Sensor Devices Inproceedings
In: Proceedings of EUROSENSORS 2018, 2018, ISBN: 978-3-00-025217-4, (EUROSENSORS, Graz, Austria; 2018-09-09 -- 2018-09-12).
System-on-Chip Sensor Integration in Advanced CMOS Technology Inproceedings
In: Proceedings of the 233textsuperscriptrd ECS Meeting (ECS), 2018, ISSN: 2151-2043, (invited; 233textsuperscriptrd ECS Meeting (ECS), Seattle, Washington, USA; 2018-05-13 -- 2018-05-17).
CMOS-Compatible Semiconductor-Based Gas Sensors Inproceedings
In: Book of Abstracts of Emerging Technologies Communication Microsystems Optoelectronics Sensors, 2018, (invited; Emerging Technologies Communication Microsystems Optoelectronics Sensing (ETCMOS), Whistler, British Columbia, Canada; 2018-05-09 -- 2018-05-11).
Unified Feature Scale Model for Etching in SF6 and Cl Plasma Chemistries Inproceedings
In: Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), pp. 65–66, 2018, ISBN: 978-1-5386-4810-0, (Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Granada, Spain; 2018-03-19 -- 2018-03-21).
Modeling Electromigration in Nanoscaled Copper Interconnects Inproceedings
In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 161–164, 2017, ISBN: 978-4-86348-612-6, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kamakura, Japan; 2017-09-07 -- 2017-09-09).
Numerical Aspects of the Deterministic Solution of the Wigner Equation Inproceedings
In: Book of Abstracts of the International Wigner Workshop (IW2), pp. 42–43, Institute for Microelectronics, TU Wien, 2017, ISBN: 978-3-200-05129-4, (International Wigner Workshop (IW2), Low Wood Bay, Lake District, UK; 2017-06-05).
Using One-Dimensional Radiosity to Model Neutral Flux in Convex High Aspect Ratio Structures Inproceedings
In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 265–268, 2016, ISBN: 978-1-5090-0817-9, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Nürnberg, Deutschland; 2016-09-06 -- 2016-09-08).
Effects of the Deposition Process Variation on the Performance of Open TSVs Inproceedings
In: Proceedings of IEEE Electronic Components and Technology Conference (ECTC), pp. 2188–2195, 2016, ISBN: 978-1-5090-1204-6, (IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA; 2016-05-31 -- 2016-06-03).
Impact of Across-Wafer Variation on the Electrical Performance of TSVs Inproceedings
In: Proceedings of the IEEE International Interconnect Technology Conference (IITC), pp. 130–132, 2016, ISBN: 978-1-5090-0386-0, (IEEE International Interconnect Technology Conference (IITC), San Jose, CA, USA; 2016-05-23 -- 2016-05-26).
Modeling the Deposition and Stress Generation in Thin Films for CMOS-Integrated Gas Sensors Inproceedings
In: Proceedings of the BIT's 2nd Annual World Congress of Smart Materials 2016, pp. 517, 2016, (invited; World Congress of Smart Materials (WCSM), Singapore; 2016-03-04 -- 2016-03-06).
Modeling Neutral Particle Flux in High Aspect Ratio Holes using a One-Dimensional Radiosity Approach Inproceedings
In: Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), pp. 68–69, 2016, ISBN: 978-3-901578-29-8, (Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Wien; 2016-01-25 -- 2016-01-27).
Processing of Integrated Gas Sensor Devices Inproceedings
In: Proceedings of the IEEE International Technical Conference of IEEE Region 10 (TENCON), 2015, ISBN: 978-1-4799-8639-2, (invited; IEEE International Technical Conference of IEEE Region 10 (TENCON), Macau, China; 2015-11-01 -- 2015-11-04).
Intrinsic Stress Analysis of Tungsten-Lined Open TSVs Inproceedings
In: Abstracts of the 26textsuperscriptth European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, pp. 71, 2015, (European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Toulouse, France; 2015-10-05 -- 2015-10-09).
Global Statistical Methodology for the Analysis of Equipment Parameter Effects on TSV Formation Inproceedings
In: Proceedings of the 6textsuperscriptth International Workshop on CMOS Variability (VARI), pp. 39–44, 2015, ISBN: 978-1-5090-0071-5, (International Workshop on CMOS Variability (VARI), Salvador, Brazil; 2015-09-01 -- 2015-09-04).
Stress in Three-Dimensionally Integrated Sensor Systems Inproceedings
In: Abstracts of the 2015 International Conference on Materials for Advanced Technologies (ICMAT), pp. 342, 2015, (invited; International Conference on Materials for Advanced Technologies(ICMAT), Singapore; 2015-06-28 -- 2015-07-03).
Stress Considerations in Thin Films for CMOS-Integrated Gas Sensors Inproceedings
In: Proceedings of the 227th ECS Meeting (ECS), ECS Transactions, 67, 2015, ISSN: 1938-6737, (Meeting of the Electrochemical Society (ECS), Chicago, Illinois, USA; 2015-05-24 -- 2015-05-28).
Kinetics of Droplet Motion During Spray Pyrolysis Inproceedings
In: Abstracts of the Energy-Materials-Nanotechnology Meeting on Droplets (EMN), pp. 127–128, 2015, (invited; Energy-Materials-Nanotechnology Meeting on Droplets (EMN), Phuket, Thailand; 2015-05-08 -- 2015-05-11).
About Processes and Performance of Integrated Gas Sensor Components Inproceedings
In: Abstracts of the Energy-Materials-Nanotechnology Fall Meeting (EMN), pp. 96–97, 2014, (invited; Energy-Materials-Nanotechnology Fall Meeting (EMN), Orlando, USA; 2014-11-22 -- 2014-11-25).
Spray Pyrolysis Deposition for Gas Sensor Integration in the Backend of Standard CMOS Processes Inproceedings
In: Proc.Intl.Conf.on Solid-State and Integrated Circuit Technology (ICSICT), pp. 1692–1695, 2014, ISBN: 978-1-4799-3282-5, (invited; International Conference on Solid State and Integrated Circuit Technology (ICSICT), Guilin, China; 2014-10-28 -- 2014-10-31).
Stress Considerations for System-on-Chip Gas Sensor Integration in CMOS Technology Inproceedings
In: Abstracts of 13th International Workshop on Stress-Induced Phenomena in Microelectronics, pp. 46, 2014, (International Workshop on Stress-Induced Phenomena in Microelectronics, Austin, TX, USA; 2014-10-15 -- 2014-10-17).
The Effects of Etching and Deposition on the Performance and Stress Evolution of Open Through Silicon Vias Inproceedings
In: Abstracts 25th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), pp. 36, 2014, (European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Berlin, Germany; 2014-09-29 -- 2014-10-02).
Three-Dimensional Simulation for the Reliability and Electrical Performance of Through-Silicon Vias Inproceedings
In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 341–344, 2014, ISBN: 978-1-4799-5285-4, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Yokohama, Japan; 2014-09-09 -- 2014-09-11).
Effects of Sidewall Scallops on the Performance and Reliability of Filled Copper and Open Tungsten TSVs Inproceedings
In: Proceedings of the 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits, pp. 321–326, 2014, ISBN: 978-1-4799-3931-2, (IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore, Singapore; 2014-06-30 -- 2014-07-04).
Effects of Sidewall Scallops on Open Tungsten TSVs Inproceedings
In: Proceedings of the International Reliability Physics Symposium (IRPS), pp. 3E.3.1–3E.3.6, 2014, ISBN: 978-1-4799-3317-4, (International Reliability Physics Symposium (IRPS), Waikoloa, Hawaii, USA; 2014-06-01 -- 2014-06-05).
Process and Reliability of SF6/O2 Plasma Etched Copper TSVs Inproceedings
In: Proceedings of the IEEE 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, ISBN: 978-1-4799-4791-1, (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Ghent, Belgium; 2014-04-07 -- 2014-04-09).