Publications

116 entries « 1 of 2 »

Journal Articles

116.

Luiz Aguinsky; Tobias Reiter; Francio Rodrigues; Xaver Klemenschits; Lado Filipovic; Andreas Hössinger; Josef Weinbub

Modeling Non-Ideal Conformality during Atomic Layer Deposition in High Aspect Ratio Structures Journal Article

In: Solid-State Electronics, 2022, (in review).

BibTeX

115.

Lado Filipovic; Oskar Baumgartner; Xaver Klemenschits; Julius Piso; Josip Bobinac; Tobias Reiter; Zlatan Stanojevic; Markus Karner

DTCO Flow for Air Spacer Generation and its Impact on Power and Performance at N7 Journal Article

In: Solid-State Electronics, 2022, (In Press).

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114.

Lado Filipovic; Siegfried Selberherr

Application of Two-Dimensional Materials towards CMOS-Integrated Gas Sensors Journal Article

In: Nanomaterials, vol. 12, iss. 20, no. 3651-1--3651-60, 2022, (Invited).

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113.

Theresia Knobloch; Burkay Uzlu; Yury Yu. Illarionov; Zhenxing Wang; Martin Otto; Lado Filipovic; Michael Waltl; Daniel Neumaier; Max C. Lemme; Tibor Grasser

Improving stability in two-dimensional transistors with amorphous gate oxides by Fermi-level tuning Journal Article

In: Nature Electronics, vol. 5, pp. 356–366, 2022.

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112.

Lado Filipovic; Tibor Grasser

Editorial for the Special Issue on Miniaturized Transistors, Volume II Journal Article

In: Micromachines, vol. 13, iss. 4, pp. 603-1–603-4, 2022.

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111.

Tobias Reiter; Xaver Klemenschits; Lado Filipovic

Impact of Plasma Induced Damage on the Fabrication of 3D NAND Flash Memory Journal Article

In: Solid-State Electronics, vol. 192, pp. 108261-1–108261-9, 2022, (invited).

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110.

Michael Waltl; Theresia Knobloch; Konstantinos Tselios; Lado Filipovic; Bernhard Stampfer; Yoanlys Hernandez; Dominic Waldhör; Yuri Illarionov; Ben Kaczer; Tibor Grasser

Perspective of 2D Integrated Electronic Circuits: Scientific Pipe Dream or Disruptive Technology? Journal Article

In: Advanced Materials, vol. Early View, pp. 2201082-1–2201082-23, 2022, (invited).

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109.

Safari Fatemeh; Mahdi Moradinasab; Udo Schwalke; Lado Filipovic

Superior Sensitivity and Optical Response of Blue Phosphorene and Its Doped Systems for Gas Sensing Applications Journal Article

In: ACS Omega, vol. 6, no. 29, pp. 18770–18781, 2021.

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108.

Lado Filipovic

Theoretical Examination of Thermo-Migration in Novel Platinum Microheaters Journal Article

In: Microelectronics Reliability, vol. 123, pp. 114219-1–114219-14, 2021.

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107.

Lado Filipovic; Siegfried Selberherr

Microstructure and Granularity Effects in Electromigration Journal Article

In: IEEE Journal of the Electron Devices Society, vol. 9, pp. 476–483, 2021, (invited).

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106.

Xaver Klemenschits; Siegfried Selberherr; Lado Filipovic

Geometric Advection and Its Application in the Emulation of High Aspect Ratio Structures Journal Article

In: Computer Methods in Applied Mechanics and Engineering, vol. 386, pp. 114196-1–114196-22, 2021.

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105.

Lado Filipovic

A Method for Simulating the Influence of Grain Boundaries and Material Interfaces on Electromigration Journal Article

In: Microelectronics Reliability, vol. 97, pp. 38–52, 2019.

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104.

Lado Filipovic; Siegfried Selberherr

Thermo-Electro-Mechanical Simulation of Semiconductor Metal Oxide Gas Sensors Journal Article

In: Materials, vol. 12, no. 15, pp. 2410-1–2410-37, 2019, (invited).

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103.

Ayoub Lahlalia; Oliver Le Neel; Ravi Shankar; Siegfried Selberherr; Lado Filipovic

Improved Sensing Capability of Integrated Semiconducting Metal Oxide Gas Sensor Devices Journal Article

In: Sensors, vol. 19, no. 2, pp. 374-1–374-14, 2019.

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102.

Lado Filipovic; Tibor Grasser

Editorial for the Special Issue on Miniaturized Transistors Journal Article

In: Micromachines, vol. 10, no. 5, pp. 1–3, 2019.

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101.

Lado Filipovic; Ayoub Lahlalia

Review-System-on-Chip SMO Gas Sensor Integration in Advanced CMOS Technology Journal Article

In: Journal of the Electrochemical Society, vol. 165, no. 16, pp. 862–879, 2018.

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100.

Xaver Klemenschits; Siegfried Selberherr; Lado Filipovic

Modeling of Gate Stack Patterning for Advanced Technology Nodes: A Review Journal Article

In: Micromachines, vol. 9, no. 12, pp. 631-1–631-31, 2018, (invited).

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99.

Ayoub Lahlalia; Lado Filipovic; Siegfried Selberherr

Modeling and Simulation of Novel Semiconducting Metal Oxide Gas Sensors for Wearable Devices Journal Article

In: IEEE Sensors Journal, vol. 18, no. 5, pp. 1960–1970, 2018.

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98.

Ayoub Lahlalia; Olivier Le Neel; Ravi Shankar; Shian-Yeu Kam; Lado Filipovic

Electro-Thermal Simulation & Characterization of a Microheater for SMO Gas Sensors Journal Article

In: Journal Of Microelectromechanical Systems, vol. 27, no. 3, pp. 529–537, 2018.

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97.

Paul Manstetten; Lado Filipovic; Andreas Hössinger; Josef Weinbub; Siegfried Selberherr

Framework to Model Neutral Particle Flux in Convex High Aspect Ratio Structures using One-Dimensional Radiosity Journal Article

In: Solid-State Electronics, vol. 128, no. 2, pp. 141–147, 2017, (invited).

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96.

Lado Filipovic; Siegfried Selberherr

Stress Considerations for System-on-Chip Gas Sensor Integration in CMOS Technology Journal Article

In: IEEE Transactions on Device and Materials Reliability, vol. 16, no. 4, pp. 483–495, 2016.

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95.

Lado Filipovic; Siegfried Selberherr

Stress in Three-Dimensionally Integrated Sensor Systems Journal Article

In: Microelectronics Reliability, vol. 61, pp. 3–10, 2016.

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94.

Eberhard Baer; P. Evanschitzky; J. Lorenz; Frederic Roger; R. Minixhofer; Lado Filipovic; Roberto Orio; Siegfried Selberherr

Coupled Simulation to Determine the Impact of Across Wafer Variations in Oxide PECVD on Electrical and Reliability Parameters of Through-Silicon Vias Journal Article

In: Microelectronic Engineering, vol. 137, pp. 141–145, 2015.

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93.

Lado Filipovic; Siegfried Selberherr

Performance and Stress Analysis of Metal Oxide Films for CMOS-Integrated Gas Sensors Journal Article

In: Sensors, vol. 15, no. 4, pp. 7206–7227, 2015.

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92.

Lado Filipovic; Anderson P. Singulani; Frederic Roger; Sara Carniello; Siegfried Selberherr

Intrinsic Stress Analysis of Tungsten-Lined Open TSVs Journal Article

In: Microelectronics Reliability, vol. 55, no. 9-10, pp. 1843–1848, 2015.

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91.

Lado Filipovic; Siegfried Selberherr

The Effects of Etching and Deposition on the Performance and Stress Evolution of Open Through Silicon Vias Journal Article

In: Microelectronics Reliability, vol. 54, no. 9-10, pp. 1953–1958, 2014.

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90.

Lado Filipovic; Siegfried Selberherr; G. C. Mutinati; Elise Brunet; Stephan Seinhauer; Anton Köck; Jordi Teva; J. Kraft; Joerg Siegert; F. Schrank

Methods of Simulating Thin Film Deposition Using Spray Pyrolysis Techniques Journal Article

In: Microelectronic Engineering, vol. 117, pp. 57–66, 2014.

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89.

Lado Filipovic; Siegfried Selberherr; G. C. Mutinati; E. Brunet; S. Steinhauer; Anton Köck; Jordi Teva; J. Kraft; Joerg Siegert; F. Schrank; Christian Gspan; Werner Grogger

Modeling the Growth of Tin Dioxide using Spray Pyrolysis Deposition for Gas Sensor Applications Journal Article

In: IEEE Transactions on Semiconductor Manufacturing, vol. 27, no. 2, pp. 269–277, 2014.

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88.

Lado Filipovic; Siegfried Selberherr

A Method for Simulating Atomic Force Microscope Nanolithography in the Level Set Framework Journal Article

In: Microelectronic Engineering, vol. 107, pp. 23–32, 2013.

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87.

Lado Filipovic; Siegfried Selberherr; G. C. Mutinati; Elise Brunet; Stephan Seinhauer; Anton Köck; Jordi Teva; J. Kraft; Joerg Siegert; F. Schrank; Christian Gspan; Werner Grogger

A Method for Simulating Spray Pyrolysis Deposition in the Level Set Framework Journal Article

In: Engineering Letters, vol. 21, no. 4, pp. 224–240, 2013, (invited).

BibTeX

Books

86.

Lado Filipovic; Tibor Grasser (Ed.)

Miniaturized Transistors, Volume II Book

MDPI, 2022, ISBN: 978-3-0365-4169-3.

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85.

Lado Filipovic; Tibor Grasser (Ed.)

Miniaturized Transistors Book

MDPI, 2019, ISBN: 978-3-03921-010-7.

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Incollections

84.

Lado Filipovic; Siegfried Selberherr

Electro-Thermo-Mechanical Simulation of Semiconductor Metal Oxide Gas Sensors Incollection

In: M. Iqubal Khan (Ed.): Prime Archives in Material Science, vol. 3, pp. 1–38, Vide Leaf, 2021, ISBN: 978-81-953047-9-0, (invited).

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83.

Tobias Reiter; Xaver Klemenschits; Lado Filipovic

Impact of High-Aspect-Ratio Etching Damage on Selective Epitaxial Silicon Growth in 3D NAND Flash Memory Incollection

In: Bogdan Cretu (Ed.): Proceedings of the 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), pp. 1–4, IEEE, 2021, ISBN: 978-1-6654-3745-5.

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82.

Raffaele Alberto Coppeta; Ayoub Lahlalia; Darjan Kozic; Rene Hammer; Johann Riedler; Gregor Toschkoff; Anderson P. Singulani; Zeeshan Ali; Martin Sagmeister; Sara Carniello; Siegfried Selberherr; Lado Filipovic

Electro-Thermal-Mechanical Modeling of Gas Sensor Hotplates Incollection

In: Willem Dirk Driel; Oliver Pyper; Cornelia Schumann (Ed.): Sensor Systems Simulations, pp. 17–72, Springer International Publishing, 2020, ISBN: 978-3-030-16577-2.

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81.

Xaver Klemenschits; Siegfried Selberherr; Lado Filipovic

Modeling of Gate Stack Patterning for Advanced Technology Nodes: A Review Incollection

In: Lado Filipovic; Tibor Grasser (Ed.): Miniaturized Transistors, pp. 105–135, MDPI, 2019, ISBN: 978-3-03921-010-7, (invited).

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80.

Lado Filipovic; Ayoub Lahlalia

System-on-Chip Sensor Integration in Advanced CMOS Technology Incollection

In: J. A. Martino; J. -P. Raskin; Siegfried Selberherr; H. Ishii; Francisco Gamiz; B. -Y. Nguyen; A. Yoshino (Ed.): Advanced CMOS-Compatible Semiconductor Devices 18, Vol. 85, No. 8, pp. 151–162, ECS Transactions, 2018, ISBN: 978-1-62332-488-9, (invited).

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79.

Xaver Klemenschits; Siegfried Selberherr; Lado Filipovic

Unified Feature Scale Model for Etching in SF6 and Cl Plasma Chemistries Incollection

In: Francisco Gamiz; Viktor Sverdlov; Carlos Sampedro; Luca Donetti (Ed.): Proceedings of the 2018 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), pp. 177–180, IEEE, 2018, ISBN: 978-1-5386-4812-4.

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78.

Paul Manstetten; Lado Filipovic; Andreas Hössinger; Josef Weinbub; Siegfried Selberherr

Using One-Dimensional Radiosity to Model Neutral Particle Flux in High Aspect Ratio Holes Incollection

In: Viktor Sverdlov; Siegfried Selberherr (Ed.): Proceedings of the 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), pp. 120–123, IEEE, 2016, ISBN: 978-1-4673-8608-1.

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77.

Lado Filipovic; Siegfried Selberherr

Stress Considerations in Thin Films for CMOS-Integrated Gas Sensors Incollection

In: Y. Omura; J. A. Martino; J. -P. Raskin; Siegfried Selberherr; H. Ishii; Francisco Gamiz; B. -Y. Nguyen (Ed.): Advanced CMOS-Compatible Semiconductor Devices 17, Vol.66, No.5, pp. 243–250, ECS Transactions, 2015, ISBN: 978-1-62332-238-0.

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76.

Lado Filipovic; Siegfried Selberherr; Giorgio C. Mutinati; Elise Brunet; S. Steinhauer; Anton Köck; Jordi Teva; J. Kraft; Joerg Siegert; F. Schrank; Christian Gspan; Werner Grogger

Modeling and Analysis of Spray Pyrolysis Deposited SnO2 Films for Gas Sensors Incollection

In: Gi-Chul Yang; Sio-Long Ao; Len Gelman (Ed.): Transactions on Engineering Technologies, pp. 295–310, Springer, 2014, ISBN: 978-94-017-8831-1.

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75.

Lado Filipovic; Siegfried Selberherr

A Monte Carlo Simulator for Non-contact Mode Atomic Force Microscopy Incollection

In: Ivan Lirkov; S. Margenov; J. Wasniewski (Ed.): Large-Scale Scientific Computing, Lecture Notes in Computer Science, vol. 7116, pp. 447–454, Springer Berlin Heidelberg, 2012, ISBN: 978-3-642-29842-4.

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74.

Lado Filipovic; Siegfried Selberherr

A Two-Dimensional Lorentzian Distribution for an Atomic Force Microscopy Simulator Incollection

In: K. K. Sabelfeld; Ivan Dimov (Ed.): Monte Carlo Methods and Applications, pp. 97–104, De Gruyter, 2012, ISBN: 978-3-11-029347-0.

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73.

Josef Weinbub; Karl Rupp; Lado Filipovic; Alexander Makarov; Siegfried Selberherr

Towards a Free Open Source Process and Device Simulation Framework Incollection

In: The 15th International Workshop on Computational Electronics (IWCE), pp. 1–4, IEEE Xplore, 2012, ISBN: 978-1-4673-0705-5.

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Inproceedings

72.

Lado Filipovic

Reliability of Platinum Microheater Geometries for MEMS-Based Gas Sensors Inproceedings

In: Proceedings of the IEEE International Integrated Reliability Workshop (IIRW), pp. 1-6, 2022, (International Integrated Reliability Workshop (IIRW), Fallen Leaf Lake, California (USA); 2022-10-09 -- 2022-10-13).

BibTeX

71.

Tobias Reiter; Xaver Klemenschits; Lado Filipovic

Modeling Plasma-Induced Damage During the Dry Etching of Silicon Inproceedings

In: Proceedings of the IEEE International Integrated Reliability Workshop (IIRW), pp. 1-5, 2022, (International Integrated Reliability Workshop (IIRW), Fallen Leaf Lake, California (USA); 2022-10-09 -- 2022-10-13).

BibTeX

70.

Lado Filipovic

ViennaEMC: A Broadly-Applicable Ensemble Monte Carlo Framework Inproceedings

In: Abstract Booklet of the Workshop on Monte Carlo Simulation: Beyond Moore’s Law at the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 1, 2022, (Workshop on Monte Carlo Simulation: Beyond Moore’s Law at the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Granada, Spain; 2022-09-05).

BibTeX

69.

Lado Filipovic; Oskar Baumgartner; Xaver Klemenschits; Julius Piso; Josip Bobinac; Tobias Reiter; Zlatan Stanojevic; Markus Karner

DTCO Flow for Air Spacer Generation and its Impact on Power and Performance at N7 Inproceedings

In: Abstract Booklet of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 34-35, 2022, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Granada, Spain; 2022-09-06 -- 2022-09-08).

BibTeX

68.

Luiz Aguinsky; Francio Rodrigues; Xaver Klemenschits; Lado Filipovic; Andreas Hössinger; Josef Weinbub

Modeling Non-Ideal Conformality during Atomic Layer Deposition in High Aspect Ratio Structures Inproceedings

In: Abstract Booklet of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 32-33, 2022, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Granada, Spain; 2022-09-06 -- 2022-09-08).

BibTeX

67.

Laura Gollner; Robin Steiner; Lado Filipovic

Study of Phonon-limited Electron Transport in Monolayer MoS2 Inproceedings

In: Proceedings of the International Conference on Microelectronic Devices and Technologies (MicDAT), pp. 74-78, 2022, (International Conference on Microelectronic Devices and Technologies (MicDAT), Corfu, Greece; 2022-09-21 -- 2022-09-23).

BibTeX

66.

Josip Bobinac; Tobias Reiter; Julius Piso; Xaver Klemenschits; Oskar Baumgartner; Zlatan Stanojevic; Georg Stroff; Markus Karner; Lado Filipovic

Impact of Mask Tapering on SF6/O2 Plasma Etching Inproceedings

In: Proceedings of the International Conference on Microelectronic Devices and Technologies (MicDAT), pp. 91-94, 2022, (International Conference on Microelectronic Devices and Technologies (MicDAT), Corfu, Greece; 2022-09-21 -- 2022-09-23).

BibTeX

65.

Lado Filipovic

Reliability and Stability of MEMS Microheaters for Gas Sensors Inproceedings

In: Proceedings of the IEEE International Integrated Reliability Workshop (IIRW), pp. 1-10, 2021, (International Integrated Reliability Workshop (IIRW), Fallen Leaf Lake, California (USA) - virtual; 2021-10-04 -- 2021-10-28).

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64.

Lado Filipovic; Xaver Klemenschits

Fast Model for Deposition in Trenches using Geometric Advection Inproceedings

In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 224–228, 2021, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Dallas, Texas (USA); 2021-09-27 -- 2021-09-29).

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63.

Xaver Klemenschits; Siegfried Selberherr; Lado Filipovic

Combined Process Simulation and Emulation of an SRAM Cell of the 5nm Technology Node Inproceedings

In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 23–27, 2021, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Dallas, Texas (USA); 2021-09-27 -- 2021-09-29).

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62.

Lado Filipovic; Siegfried Selberherr

Gas Sensing with Two-Dimensional Materials Beyond Graphene Inproceedings

In: Proceedings of the International Conference on Microelectronics (MIEL), pp. 29–36, 2021, ISBN: 978-1-6654-4526-9, (invited; International Conference on Microelectronics (MIEL), Nis, Serbia; 2021-09-12 -- 2021-09-14).

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61.

Tobias Reiter; Xaver Klemenschits; Lado Filipovic

Impact of High-Aspect-Ratio Etching Damage on Selective Epitaxial Silicon Growth in 3D NAND Flash Memory Inproceedings

In: Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), pp. 34–35, 2021, (Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Caen, France; 2021-09-01 -- 2021-09-03).

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60.

Lado Filipovic

Modeling and Simulation of ALD in a Level Set Framework Inproceedings

In: Proceedings of the EFDS Workshop on Simulation for ALD, pp. 9, 2021, (invited; EFDS Workshop on Simulation for ALD, virtual; 2021-03-25).

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59.

Lado Filipovic

Electromigration Model for Platinum Hotplates Inproceedings

In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 315–318, 2020, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kobe, Japan - virtual; 2020-09-23 -- 2020-10-06).

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58.

Xaver Klemenschits; Siegfried Selberherr; Lado Filipovic

Geometric Advection Algorithm for Process Emulation Inproceedings

In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 59–62, 2020, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kobe, Japan - virtual; 2020-09-23 -- 2020-10-06).

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57.

Lado Filipovic; Siegfried Selberherr

Integration of Gas Sensors with CMOS Technology Inproceedings

In: Proceedings of the IEEE Electron Devices Technology and Manufacturing Conference (EDTM), pp. 294–297, 2020, ISBN: 978-1-7281-2539-8, (invited; IEEE Electron Devices Technology and Manufacturing Conference (EDTM), Penang, Malaysia - virtual; 2020-03-16 -- 2020-03-18).

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56.

Lado Filipovic; Siegfried Selberherr

Granularity Effects in Electromigration Inproceedings

In: Proceedings of the IEEE Latin America Electron Devices Conference (LAEDC), 2020, ISBN: 978-1-7281-1044-8, (invited; IEEE Latin America Electron Devices Conference (LAEDC), San Jose, Costa Rica; 2020-02-25 -- 2020-02-28).

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55.

Lado Filipovic; Siegfried Selberherr

CMOS-Compatible Gas Sensors Inproceedings

In: Proceedings of the International Conference on Microelectronics (MIEL), pp. 9–16, 2019, (invited; International Conference on Microelectronics (MIEL), Nis, Serbia; 2019-09-16 -- 2019-09-18).

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54.

Lado Filipovic

Modeling and Simulation of Atomic Layer Deposition Inproceedings

In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 323–326, 2019, ISBN: 978-1-7281-0938-1, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Udine, Italy; 2019-09-04 -- 2019-09-06).

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53.

Xaver Klemenschits; Paul Manstetten; Lado Filipovic; Siegfried Selberherr

Process Simulation in the Browser: Porting ViennaTS using WebAssembly Inproceedings

In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 339–342, 2019, ISBN: 978-1-7281-0938-1, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Udine, Italy; 2019-09-04 -- 2019-09-06).

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52.

Lado Filipovic; Roberto Orio

Electromigration in Nano-Interconnects Inproceedings

In: Book of Abstracts of the Workshop on High Performance TCAD (WHPTCAD), pp. 2, 2019, (invited; Workshop on High Performance TCAD (WHPTCAD), Chicago, IL, USA; 2019-05-24 -- 2019-05-25).

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51.

Xaver Klemenschits; Siegfried Selberherr; Lado Filipovic

Fast Volume Evaluation on Sparse Level Sets Inproceedings

In: Book of Abstracts of the International Workshop on Computational Nanotechnology (IWCN), pp. 113–114, 2019, ISBN: 978-3-9504738-0-3, (International Workshop on Computational Nanotechnology (IWCN), Chicago, IL, USA; 2019-05-20 -- 2019-05-24).

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50.

Siegfried Selberherr; Lado Filipovic

CMOS Compatible Gas Sensors Inproceedings

In: Book of Abstracts of the International Conference on Materials Science and Engineering, 2019, (invited; International Conference on Materials Science and Engineering, San Francisco, CA, USA; 2019-02-18 -- 2019-02-20).

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49.

Lado Filipovic; Roberto Orio

Modeling the Influence of Grains and Material Interfaces on Electromigration Inproceedings

In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 83–87, 2018, ISBN: 978-1-5386-6788-0, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Austin, Texas, USA; 2018-09-24 -- 2018-09-26).

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48.

Ayoub Lahlalia; Olivier Le Neel; Ravi Shankar; Siegfried Selberherr; Lado Filipovic

Enhanced Sensing Performance of Integrated Gas Sensor Devices Inproceedings

In: Proceedings of EUROSENSORS 2018, 2018, ISBN: 978-3-00-025217-4, (EUROSENSORS, Graz, Austria; 2018-09-09 -- 2018-09-12).

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47.

Lado Filipovic; Ayoub Lahlalia; Siegfried Selberherr

System-on-Chip Sensor Integration in Advanced CMOS Technology Inproceedings

In: Proceedings of the 233textsuperscriptrd ECS Meeting (ECS), 2018, ISSN: 2151-2043, (invited; 233textsuperscriptrd ECS Meeting (ECS), Seattle, Washington, USA; 2018-05-13 -- 2018-05-17).

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46.

Lado Filipovic

CMOS-Compatible Semiconductor-Based Gas Sensors Inproceedings

In: Book of Abstracts of Emerging Technologies Communication Microsystems Optoelectronics Sensors, 2018, (invited; Emerging Technologies Communication Microsystems Optoelectronics Sensing (ETCMOS), Whistler, British Columbia, Canada; 2018-05-09 -- 2018-05-11).

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45.

Xaver Klemenschits; Siegfried Selberherr; Lado Filipovic

Unified Feature Scale Model for Etching in SF6 and Cl Plasma Chemistries Inproceedings

In: Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), pp. 65–66, 2018, ISBN: 978-1-5386-4810-0, (Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Granada, Spain; 2018-03-19 -- 2018-03-21).

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44.

Lado Filipovic; R. L. Orio; Wolfhard Zisser; Siegfried Selberherr

Modeling Electromigration in Nanoscaled Copper Interconnects Inproceedings

In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 161–164, 2017, ISBN: 978-4-86348-612-6, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kamakura, Japan; 2017-09-07 -- 2017-09-09).

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43.

Johann Cervenka; Lado Filipovic

Numerical Aspects of the Deterministic Solution of the Wigner Equation Inproceedings

In: Book of Abstracts of the International Wigner Workshop (IW2), pp. 42–43, Institute for Microelectronics, TU Wien, 2017, ISBN: 978-3-200-05129-4, (International Wigner Workshop (IW2), Low Wood Bay, Lake District, UK; 2017-06-05).

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42.

Paul Manstetten; Lado Filipovic; Andreas Hössinger; Josef Weinbub; Siegfried Selberherr

Using One-Dimensional Radiosity to Model Neutral Flux in Convex High Aspect Ratio Structures Inproceedings

In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 265–268, 2016, ISBN: 978-1-5090-0817-9, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Nürnberg, Deutschland; 2016-09-06 -- 2016-09-08).

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41.

Lado Filipovic; Siegfried Selberherr

Effects of the Deposition Process Variation on the Performance of Open TSVs Inproceedings

In: Proceedings of IEEE Electronic Components and Technology Conference (ECTC), pp. 2188–2195, 2016, ISBN: 978-1-5090-1204-6, (IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA; 2016-05-31 -- 2016-06-03).

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40.

Lado Filipovic; Anderson P. Singulani; Frederic Roger; Sara Carniello; Siegfried Selberherr

Impact of Across-Wafer Variation on the Electrical Performance of TSVs Inproceedings

In: Proceedings of the IEEE International Interconnect Technology Conference (IITC), pp. 130–132, 2016, ISBN: 978-1-5090-0386-0, (IEEE International Interconnect Technology Conference (IITC), San Jose, CA, USA; 2016-05-23 -- 2016-05-26).

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39.

Lado Filipovic; Siegfried Selberherr

Modeling the Deposition and Stress Generation in Thin Films for CMOS-Integrated Gas Sensors Inproceedings

In: Proceedings of the BIT's 2nd Annual World Congress of Smart Materials 2016, pp. 517, 2016, (invited; World Congress of Smart Materials (WCSM), Singapore; 2016-03-04 -- 2016-03-06).

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38.

Paul Manstetten; Lado Filipovic; Andreas Hössinger; Josef Weinbub; Siegfried Selberherr

Modeling Neutral Particle Flux in High Aspect Ratio Holes using a One-Dimensional Radiosity Approach Inproceedings

In: Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), pp. 68–69, 2016, ISBN: 978-3-901578-29-8, (Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Wien; 2016-01-25 -- 2016-01-27).

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37.

Lado Filipovic; Siegfried Selberherr

Processing of Integrated Gas Sensor Devices Inproceedings

In: Proceedings of the IEEE International Technical Conference of IEEE Region 10 (TENCON), 2015, ISBN: 978-1-4799-8639-2, (invited; IEEE International Technical Conference of IEEE Region 10 (TENCON), Macau, China; 2015-11-01 -- 2015-11-04).

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36.

Lado Filipovic; Anderson P. Singulani; Frederic Roger; Sara Carniello; Siegfried Selberherr

Intrinsic Stress Analysis of Tungsten-Lined Open TSVs Inproceedings

In: Abstracts of the 26textsuperscriptth European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, pp. 71, 2015, (European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Toulouse, France; 2015-10-05 -- 2015-10-09).

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35.

Frederic Roger; Anderson P. Singulani; Sara Carniello; Lado Filipovic; Siegfried Selberherr

Global Statistical Methodology for the Analysis of Equipment Parameter Effects on TSV Formation Inproceedings

In: Proceedings of the 6textsuperscriptth International Workshop on CMOS Variability (VARI), pp. 39–44, 2015, ISBN: 978-1-5090-0071-5, (International Workshop on CMOS Variability (VARI), Salvador, Brazil; 2015-09-01 -- 2015-09-04).

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34.

Lado Filipovic; Siegfried Selberherr

Stress in Three-Dimensionally Integrated Sensor Systems Inproceedings

In: Abstracts of the 2015 International Conference on Materials for Advanced Technologies (ICMAT), pp. 342, 2015, (invited; International Conference on Materials for Advanced Technologies(ICMAT), Singapore; 2015-06-28 -- 2015-07-03).

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33.

Lado Filipovic; Siegfried Selberherr

Stress Considerations in Thin Films for CMOS-Integrated Gas Sensors Inproceedings

In: Proceedings of the 227th ECS Meeting (ECS), ECS Transactions, 67, 2015, ISSN: 1938-6737, (Meeting of the Electrochemical Society (ECS), Chicago, Illinois, USA; 2015-05-24 -- 2015-05-28).

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32.

Lado Filipovic; Siegfried Selberherr

Kinetics of Droplet Motion During Spray Pyrolysis Inproceedings

In: Abstracts of the Energy-Materials-Nanotechnology Meeting on Droplets (EMN), pp. 127–128, 2015, (invited; Energy-Materials-Nanotechnology Meeting on Droplets (EMN), Phuket, Thailand; 2015-05-08 -- 2015-05-11).

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31.

Lado Filipovic; Siegfried Selberherr

About Processes and Performance of Integrated Gas Sensor Components Inproceedings

In: Abstracts of the Energy-Materials-Nanotechnology Fall Meeting (EMN), pp. 96–97, 2014, (invited; Energy-Materials-Nanotechnology Fall Meeting (EMN), Orlando, USA; 2014-11-22 -- 2014-11-25).

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30.

Lado Filipovic; Siegfried Selberherr

Spray Pyrolysis Deposition for Gas Sensor Integration in the Backend of Standard CMOS Processes Inproceedings

In: Proc.Intl.Conf.on Solid-State and Integrated Circuit Technology (ICSICT), pp. 1692–1695, 2014, ISBN: 978-1-4799-3282-5, (invited; International Conference on Solid State and Integrated Circuit Technology (ICSICT), Guilin, China; 2014-10-28 -- 2014-10-31).

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29.

Lado Filipovic; Siegfried Selberherr

Stress Considerations for System-on-Chip Gas Sensor Integration in CMOS Technology Inproceedings

In: Abstracts of 13th International Workshop on Stress-Induced Phenomena in Microelectronics, pp. 46, 2014, (International Workshop on Stress-Induced Phenomena in Microelectronics, Austin, TX, USA; 2014-10-15 -- 2014-10-17).

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28.

Lado Filipovic; Siegfried Selberherr

The Effects of Etching and Deposition on the Performance and Stress Evolution of Open Through Silicon Vias Inproceedings

In: Abstracts 25th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), pp. 36, 2014, (European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Berlin, Germany; 2014-09-29 -- 2014-10-02).

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27.

Lado Filipovic; Florian Rudolf; Eberhard Baer; P. Evanschitzky; J. Lorenz; Frederic Roger; Anderson P. Singulani; R. Minixhofer; Siegfried Selberherr

Three-Dimensional Simulation for the Reliability and Electrical Performance of Through-Silicon Vias Inproceedings

In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 341–344, 2014, ISBN: 978-1-4799-5285-4, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Yokohama, Japan; 2014-09-09 -- 2014-09-11).

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26.

Lado Filipovic; Roberto Orio; Siegfried Selberherr

Effects of Sidewall Scallops on the Performance and Reliability of Filled Copper and Open Tungsten TSVs Inproceedings

In: Proceedings of the 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits, pp. 321–326, 2014, ISBN: 978-1-4799-3931-2, (IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore, Singapore; 2014-06-30 -- 2014-07-04).

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25.

Lado Filipovic; Roberto Orio; Siegfried Selberherr; Anderson P. Singulani; Frederic Roger; R. Minixhofer

Effects of Sidewall Scallops on Open Tungsten TSVs Inproceedings

In: Proceedings of the International Reliability Physics Symposium (IRPS), pp. 3E.3.1–3E.3.6, 2014, ISBN: 978-1-4799-3317-4, (International Reliability Physics Symposium (IRPS), Waikoloa, Hawaii, USA; 2014-06-01 -- 2014-06-05).

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24.

Lado Filipovic; Roberto Orio; Siegfried Selberherr

Process and Reliability of SF6/O2 Plasma Etched Copper TSVs Inproceedings

In: Proceedings of the IEEE 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, ISBN: 978-1-4799-4791-1, (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Ghent, Belgium; 2014-04-07 -- 2014-04-09).

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23.

Eberhard Baer; P. Evanschitzky; J. Lorenz; Frederic Roger; R. Minixhofer; Lado Filipovic; Roberto Orio; Siegfried Selberherr

Coupled Simulation to Determine Across Wafer Variations for Electrical and Reliability Parameters of Through-Silicon VIAs Inproceedings

In: Book of Abstracts, 2014, (European Workshop on Materials for Advanced Metallization (MAM), Chemnitz, Germany; 2014-03-02 -- 2014-03-05).

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22.

Lado Filipovic; Roberto Orio; Siegfried Selberherr

Process and Performance of Copper TSVs Inproceedings

In: Conference Proceedings of the Tenth Workshop of the Thematic Network on Silicon on Insulator Technology, Devices and Circuits, pp. 1–2, 2014, (Workshop of the Thematic Network on Silicon On Insulator Technology, Devices and Circuits (EUROSOI), Tarragona, Spain; 2014-01-27 -- 2014-01-29).

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21.

Lado Filipovic; Siegfried Selberherr; G. C. Mutinati; E. Brunet; S. Steinhauer; Anton Köck; Jordi Teva; J. Kraft; Joerg Siegert; F. Schrank; Christian Gspan; Werner Grogger

Modeling the Growth of Thin SnO2 Films using Spray Pyrolysis Deposition Inproceedings

In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 208–211, 2013, ISBN: 978-1-4673-5733-3, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Glasgow, Scotland, United Kingdom; 2013-09-03 -- 2013-09-05).

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20.

Lado Filipovic; Siegfried Selberherr; G. C. Mutinati; E. Brunet; S. Steinhauer; Anton Köck; Jordi Teva; J. Kraft; Joerg Siegert; F. Schrank

Modeling Spray Pyrolysis Deposition Inproceedings

In: Proceedings of the World Congress on Engineering (WCE) Vol II, pp. 987–992, 2013, ISBN: 978-988-19252-8-2, (World Congress on Engineering (WCE), London, UK; 2013-07-03 -- 2013-07-05).

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19.

Anderson P. Singulani; Hajdin Ceric; Lado Filipovic; Erasmus Langer

Impact of Bosch Scallops Dimensions on Stress of an Open Through Silicon Via Technology Inproceedings

In: Proceedings of the IEEE 14th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EurSimE), 2013, ISBN: 978-1-4673-6137-8, (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Poland; 2013-04-14 -- 2013-04-17).

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18.

Lado Filipovic; Siegfried Selberherr

Simulations of Local Oxidation Nanolithography by AFM Based on the Generated Electric Field Inproceedings

In: Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), pp. 189–192, 2012, ISBN: 978-0-615-71756-2, (International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Denver, CO, USA; 2012-09-05 -- 2012-09-07).

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17.

Lado Filipovic; Siegfried Selberherr

Electric Field Based Simulations of Local Oxidation Nanolithography using Atomic Force Microscopy in a Level Set Environment Inproceedings

In: ECS Transactions, pp. 265–272, 49, 1, 2012, ISBN: 978-1-56677-990-6, (Intl. Symposium on Microelectronics Technology and Devices (SBMicro), Brasilia, Brazil; 2012-08-30 -- 2012-09-02).

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