Publications

@inproceedings{stella2024prime,

title = {Atomistic Study of 4H-SiC Using Ab Initio and Machine Learning Techniques (invited)},

author = {Robert Stella and Sabine Leroch and Andreas Hössinger and Lado Filipovic},

year  = {2024},

date = {2024-10-01},

booktitle = {Joint International Meeting of The Electrochemical Society (ECS), The Electrochemical Society of Japan (ECSJ), and The Korean Electrochemical Society (KECS) - PRiME 2024},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{filipovic2024efficient,

title = {Efficient Multi-Scale Modeling of Semiconductor Device Fabrication (invited)},

author = {Lado Filipovic},

year  = {2024},

date = {2024-01-01},

booktitle = {Proceedings of the 5th International Congress on Advanced Materials Sciences and Engineering (AMSE)},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{filipovic2024semiconductor,

title = {Semiconductor Fabrication at Multiple Time and Length Scales (invited)},

author = {Lado Filipovic},

year  = {2024},

date = {2024-01-01},

booktitle = {Proceedings of Austrochip - Workshop on Microelectronics},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{filipovic2024modelingALD,

title = {Modeling and Simulation of ALD in a Level Set Framework (invited)},

author = {Lado Filipovic},

year  = {2024},

date = {2024-01-01},

booktitle = {Proceedings of the 7th International Conference ALD for Industry},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{filipovic2024merging,

title = {Merging Reactor and Feature Scales for Plasma Etch Modeling (invited)},

author = {Lado Filipovic},

year  = {2024},

date = {2024-01-01},

booktitle = {Proceedings of IEEE Nanotechnology Council - IEEE NANO 2024},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{filipovic2024multiscale,

title = {Multi-Scale Process TCAD for Advanced Semiconductor Fabrication},

author = {Lado Filipovic and Balazs Bamer and Sabine Leroch and Tobias Reiter and Robert Stella and Andreas Hössinger},

year  = {2024},

date = {2024-01-01},

urldate = {2024-01-01},

booktitle = {Book of Abstracts MESS24 - Microelectronic Systems Symposium},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{bamer2024cluster,

title = {Cluster-Based Model for Dopant Activation in SiC},

author = {Balazs Bamer and Andreas Hössinger and Lado Filipovic},

year  = {2024},

date = {2024-01-01},

urldate = {2024-01-01},

booktitle = {Book of Abstracts MESS24 - Microelectronic Systems Symposium},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{filipovic2024plasmatech,

title = {Multi-Scale Model for High Aspect Ratio TiN Etching in a Cl$_2$/Ar Inductively Coupled Plasma},

author = {Lado Filipovic and Tobias Reiter},

year  = {2024},

date = {2024-01-01},

booktitle = {Proceedings of the Plasma Processing and Technology International Conference (PlasmaTech)},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{filipovic2024spline,

title = {Spline Interpolation-Based Multi-Scale Model for Etching in a Chlorine-Argon Inductively Coupled Plasma},

author = {Lado Filipovic and Tobias Reiter},

year  = {2024},

date = {2024-01-01},

booktitle = {Proceedings of the 20th International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM)},

note = {Part of Winter Simulation Conference (WSC)},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{hu2024modeling,

title = {Modeling Non-Uniformity During Two-Step Dry Etching of Si/SiGe Stacks for Gate-All-Around FETs},

author = {Ziyi Hu and Lado Filipovic and Junjie Li and Lingfei Wang and Zhicheng Wu and Rui Chen and Yayi Wei and Ling Li},

year  = {2024},

date = {2024-01-01},

booktitle = {2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{leroch2024md,

title = {MD Simulation of Epitaxial Recrystallization and Defect Structure of Al-Implanted 4H-SiC},

author = {Sabine Leroch and Robert Stella and Andreas Hössinger and Lado Filipovic},

year  = {2024},

date = {2024-01-01},

booktitle = {2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{filipovic2024equipment,

title = {Equipment-Informed Machine Learning-Assisted Feature-Scale Plasma Etching Model},

author = {Lado Filipovic and Tobias Reiter and Julius Piso and Roman Kostal},

year  = {2024},

date = {2024-01-01},

booktitle = {2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{reiter2024impact,

title = {Impact of Ion Energy and Yield in Oblique Ion Beam Etching Process for Blazed Gratings},

author = {T. Reiter and A. Toifl and S. W. Kong and A. Hössinger and Lado Filipovic},

year  = {2024},

date = {2024-01-01},

booktitle = {2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{bamer2024clusterAMASIS,

title = {Cluster-Based Multivariate Spline Model for Dopant Activation in SiC},

author = {Balazs Bamer and Andreas Hössinger and Lado Filipovic},

year  = {2024},

date = {2024-01-01},

urldate = {2024-01-01},

booktitle = {Book of Abstracts AMaSiS 2024 - Applied Mathematics and Simulation for Semiconductor Devices},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{bamer2024equipment,

title = {Cluster-based semi-empirical model for dopant activation in silicon carbide},

author = {Balazs Bamer and Sabine Leroch and Andreas Hössinger and Lado Filipovic},

year  = {2024},

date = {2024-01-01},

booktitle = {2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{filipovic2023iwcnb,

title = {Process Simulation in Micro- and Nano-electronics},

author = {Lado Filipovic and Tobias Reiter and Xaver Klemenschits and Sabine Leroch and Robert Stella and Oskar Baumgartner and Andreas Hössinger},

url = {https://iwcn2023.uab.es/IWCN2023_book_of_abstracts.pdf},

year  = {2023},

date = {2023-06-12},

urldate = {2023-06-12},

booktitle = { IWCN - International Workshop on Computational Nanotechnology (2023)},

pages = {38-39},

note = {Invited},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{filipovic2022reliability,

title = {Reliability of Platinum Microheater Geometries for MEMS-Based Gas Sensors},

author = {Lado Filipovic},

doi = {10.1109/IIRW56459.2022.10032744},

year  = {2023},

date = {2023-02-07},

urldate = {2022-01-01},

booktitle = {Proceedings of the IEEE International Integrated Reliability Workshop (IIRW)},

pages = {1-6},

publisher = {IEEE},

note = {International Integrated Reliability Workshop (IIRW), Fallen Leaf Lake, California (USA); 2022-10-09 -- 2022-10-13},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{reiter2022modeling,

title = {Modeling Plasma-Induced Damage During the Dry Etching of Silicon},

author = {Tobias Reiter and Xaver Klemenschits and Lado Filipovic},

doi = {10.1109/IIRW56459.2022.10032764},

year  = {2023},

date = {2023-02-07},

urldate = {2022-01-01},

booktitle = {Proceedings of the IEEE International Integrated Reliability Workshop (IIRW)},

pages = {1-5},

publisher = {IEEE},

note = {International Integrated Reliability Workshop (IIRW), Fallen Leaf Lake, California (USA); 2022-10-09 -- 2022-10-13},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{filipovic2022viennaEMC,

title = {ViennaEMC: A Broadly-Applicable Ensemble Monte Carlo Framework},

author = {Lado Filipovic},

year  = {2022},

date = {2022-01-01},

booktitle = {Abstract Booklet of the Workshop on Monte Carlo Simulation: Beyond Moore’s Law at the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

pages = {1},

note = {Workshop on Monte Carlo Simulation: Beyond Moore’s Law at the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Granada, Spain; 2022-09-05},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{filipovic2022DTCO,

title = {DTCO Flow for Air Spacer Generation and its Impact on Power and Performance at N7},

author = {Lado Filipovic and Oskar Baumgartner and Xaver Klemenschits and Julius Piso and Josip Bobinac and Tobias Reiter and Zlatan Stanojevic and Markus Karner},

url = {https://ladofilipovic.net/wp-content/uploads/2023/04/abstract.pdf},

year  = {2022},

date = {2022-01-01},

urldate = {2022-01-01},

booktitle = {Abstract Booklet of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

pages = {34-35},

note = {International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Granada, Spain; 2022-09-06 -- 2022-09-08},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{aguinsky2022modeling,

title = {Modeling Non-Ideal Conformality during Atomic Layer Deposition in High Aspect Ratio Structures},

author = {Luiz Aguinsky and Francio Rodrigues and Xaver Klemenschits and Lado Filipovic and Andreas Hössinger and Josef Weinbub},

year  = {2022},

date = {2022-01-01},

booktitle = {Abstract Booklet of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

pages = {32-33},

note = {International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Granada, Spain; 2022-09-06 -- 2022-09-08},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{gollner2022impact,

title = {Study of Phonon-limited Electron Transport in Monolayer MoS2},

author = {Laura Gollner and Robin Steiner and Lado Filipovic},

year  = {2022},

date = {2022-01-01},

booktitle = {Proceedings of the International Conference on Microelectronic Devices and Technologies (MicDAT)},

pages = {74-78},

note = {International Conference on Microelectronic Devices and Technologies (MicDAT), Corfu, Greece; 2022-09-21 -- 2022-09-23},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{bobinac2022impact,

title = {Impact of Mask Tapering on SF6/O2 Plasma Etching},

author = {Josip Bobinac and Tobias Reiter and Julius Piso and Xaver Klemenschits and Oskar Baumgartner and Zlatan Stanojevic and Georg Stroff and Markus Karner and Lado Filipovic},

year  = {2022},

date = {2022-01-01},

booktitle = {Proceedings of the International Conference on Microelectronic Devices and Technologies (MicDAT)},

pages = {91-94},

note = {International Conference on Microelectronic Devices and Technologies (MicDAT), Corfu, Greece; 2022-09-21 -- 2022-09-23},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{9635162,

title = {Reliability and Stability of MEMS Microheaters for Gas Sensors},

author = {Lado Filipovic},

doi = {10.1109/IIRW53245.2021.9635162},

year  = {2021},

date = {2021-01-01},

booktitle = {Proceedings of the IEEE International Integrated Reliability Workshop (IIRW)},

pages = {1-10},

note = {International Integrated Reliability Workshop (IIRW), Fallen Leaf Lake, California (USA) - virtual; 2021-10-04 -- 2021-10-28},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-297929,

title = {Fast Model for Deposition in Trenches using Geometric Advection},

author = {Lado Filipovic and Xaver Klemenschits},

url = {https://www.iue.tuwien.ac.at/pdf/ib_2021/CP2021_Filipovic_5.pdf},

doi = {10.1109/SISPAD54002.2021.9592595},

year  = {2021},

date = {2021-01-01},

booktitle = {Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

pages = {224--228},

note = {International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Dallas, Texas (USA); 2021-09-27 -- 2021-09-29},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-297930,

title = {Combined Process Simulation and Emulation of an SRAM Cell of the 5nm Technology Node},

author = {Xaver Klemenschits and Siegfried Selberherr and Lado Filipovic},

url = {https://www.iue.tuwien.ac.at/pdf/ib_2021/CP2021_Klemenschits_1.pdf},

doi = {10.1109/SISPAD54002.2021.9592605},

year  = {2021},

date = {2021-01-01},

booktitle = {Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

pages = {23--27},

note = {International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Dallas, Texas (USA); 2021-09-27 -- 2021-09-29},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-297865,

title = {Gas Sensing with Two-Dimensional Materials Beyond Graphene},

author = {Lado Filipovic and Siegfried Selberherr},

url = {https://www.iue.tuwien.ac.at/pdf/ib_2021/CP2021_Filipovic_4.pdf},

doi = {10.1109/MIEL52794.2021.9569088},

isbn = {978-1-6654-4526-9},

year  = {2021},

date = {2021-01-01},

booktitle = {Proceedings of the International Conference on Microelectronics (MIEL)},

pages = {29--36},

note = {invited; International Conference on Microelectronics (MIEL), Nis, Serbia; 2021-09-12 -- 2021-09-14},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-299072,

title = {Impact of High-Aspect-Ratio Etching Damage on Selective Epitaxial Silicon Growth in 3D NAND Flash Memory},

author = {Tobias Reiter and Xaver Klemenschits and Lado Filipovic},

url = {https://www.iue.tuwien.ac.at/pdf/ib_2021/CP2021_Reiter_1.pdf},

year  = {2021},

date = {2021-01-01},

booktitle = {Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)},

pages = {34--35},

note = {Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Caen, France; 2021-09-01 -- 2021-09-03},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-295598,

title = {Modeling and Simulation of ALD in a Level Set Framework},

author = {Lado Filipovic},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2021/CP2021_Filipovic_1.pdf},

year  = {2021},

date = {2021-01-01},

booktitle = {Proceedings of the EFDS Workshop on Simulation for ALD},

pages = {9},

note = {invited; EFDS Workshop on Simulation for ALD, virtual; 2021-03-25},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-290273,

title = {Electromigration Model for Platinum Hotplates},

author = {Lado Filipovic},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2020/CP2020_Filipovic_3.pdf},

doi = {10.23919/SISPAD49475.2020.9241645},

year  = {2020},

date = {2020-01-01},

booktitle = {Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

pages = {315--318},

note = {International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kobe, Japan - virtual; 2020-09-23 -- 2020-10-06},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-290266,

title = {Geometric Advection Algorithm for Process Emulation},

author = {Xaver Klemenschits and Siegfried Selberherr and Lado Filipovic},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2020/CP2020_Klemenschits_1.pdf},

doi = {10.23919/SISPAD49475.2020.9241678},

year  = {2020},

date = {2020-01-01},

booktitle = {Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

pages = {59--62},

note = {International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kobe, Japan - virtual; 2020-09-23 -- 2020-10-06},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-288670,

title = {Integration of Gas Sensors with CMOS Technology},

author = {Lado Filipovic and Siegfried Selberherr},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2020/CP2020_Filipovic_2.pdf},

doi = {10.1109/EDTM47692.2020.9117828},

isbn = {978-1-7281-2539-8},

year  = {2020},

date = {2020-01-01},

booktitle = {Proceedings of the IEEE Electron Devices Technology and Manufacturing Conference (EDTM)},

pages = {294--297},

note = {invited; IEEE Electron Devices Technology and Manufacturing Conference (EDTM), Penang, Malaysia - virtual; 2020-03-16 -- 2020-03-18},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-288506,

title = {Granularity Effects in Electromigration},

author = {Lado Filipovic and Siegfried Selberherr},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2020/CP2020_Filipovic_1.pdf},

doi = {10.1109/LAEDC49063.2020.9072963},

isbn = {978-1-7281-1044-8},

year  = {2020},

date = {2020-01-01},

booktitle = {Proceedings of the IEEE Latin America Electron Devices Conference (LAEDC)},

note = {invited; IEEE Latin America Electron Devices Conference (LAEDC), San Jose, Costa Rica; 2020-02-25 -- 2020-02-28},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-281281,

title = {CMOS-Compatible Gas Sensors},

author = {Lado Filipovic and Siegfried Selberherr},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2019/CP2019_Filipovic_3.pdf},

doi = {10.1109/MIEL.2019.8889585},

year  = {2019},

date = {2019-01-01},

booktitle = {Proceedings of the International Conference on Microelectronics (MIEL)},

pages = {9--16},

note = {invited; International Conference on Microelectronics (MIEL), Nis, Serbia; 2019-09-16 -- 2019-09-18},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-281116,

title = {Modeling and Simulation of Atomic Layer Deposition},

author = {Lado Filipovic},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2019/CP2019_Filipovic_2.pdf},

doi = {10.1109/SISPAD.2019.8870462},

isbn = {978-1-7281-0938-1},

year  = {2019},

date = {2019-01-01},

booktitle = {Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

pages = {323--326},

note = {International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Udine, Italy; 2019-09-04 -- 2019-09-06},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-281119,

title = {Process Simulation in the Browser: Porting ViennaTS using WebAssembly},

author = {Xaver Klemenschits and Paul Manstetten and Lado Filipovic and Siegfried Selberherr},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2019/CP2019_Klemenschits_1.pdf},

doi = {10.1109/SISPAD.2019.8870374},

isbn = {978-1-7281-0938-1},

year  = {2019},

date = {2019-01-01},

booktitle = {Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

pages = {339--342},

note = {International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Udine, Italy; 2019-09-04 -- 2019-09-06},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-280117,

title = {Electromigration in Nano-Interconnects},

author = {Lado Filipovic and Roberto Orio},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2019/CP2019_Filipovic_1.pdf},

year  = {2019},

date = {2019-01-01},

booktitle = {Book of Abstracts of the Workshop on High Performance TCAD (WHPTCAD)},

pages = {2},

note = {invited; Workshop on High Performance TCAD (WHPTCAD), Chicago, IL, USA; 2019-05-24 -- 2019-05-25},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-280146,

title = {Fast Volume Evaluation on Sparse Level Sets},

author = {Xaver Klemenschits and Siegfried Selberherr and Lado Filipovic},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2019/CP2019_Klementschits_1.pdf},

isbn = {978-3-9504738-0-3},

year  = {2019},

date = {2019-01-01},

booktitle = {Book of Abstracts of the International Workshop on Computational Nanotechnology (IWCN)},

pages = {113--114},

note = {International Workshop on Computational Nanotechnology (IWCN), Chicago, IL, USA; 2019-05-20 -- 2019-05-24},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-278583,

title = {CMOS Compatible Gas Sensors},

author = {Siegfried Selberherr and Lado Filipovic},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2018/CP2019_Selberherr_1.pdf},

year  = {2019},

date = {2019-01-01},

booktitle = {Book of Abstracts of the International Conference on Materials Science and Engineering},

note = {invited; International Conference on Materials Science and Engineering, San Francisco, CA, USA; 2019-02-18 -- 2019-02-20},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-272003,

title = {Modeling the Influence of Grains and Material Interfaces on Electromigration},

author = {Lado Filipovic and Roberto Orio},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2018/CP2018_Filipovic_3.pdf},

doi = {10.1109/SISPAD.2018.8551746},

isbn = {978-1-5386-6788-0},

year  = {2018},

date = {2018-01-01},

booktitle = {Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

pages = {83--87},

note = {International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Austin, Texas, USA; 2018-09-24 -- 2018-09-26},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-271869,

title = {Enhanced Sensing Performance of Integrated Gas Sensor Devices},

author = {Ayoub Lahlalia and Olivier Le Neel and Ravi Shankar and Siegfried Selberherr and Lado Filipovic},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2018/CP2018_Lahlalia_1.pdf},

doi = {10.3390/proceedings2131508},

isbn = {978-3-00-025217-4},

year  = {2018},

date = {2018-01-01},

booktitle = {Proceedings of EUROSENSORS 2018},

note = {EUROSENSORS, Graz, Austria; 2018-09-09 -- 2018-09-12},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-269988,

title = {System-on-Chip Sensor Integration in Advanced CMOS Technology},

author = {Lado Filipovic and Ayoub Lahlalia and Siegfried Selberherr},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2018/CP2018_Filipovic_1.pdf},

issn = {2151-2043},

year  = {2018},

date = {2018-01-01},

booktitle = {Proceedings of the 233textsuperscriptrd ECS Meeting (ECS)},

note = {invited; 233textsuperscriptrd ECS Meeting (ECS), Seattle, Washington, USA; 2018-05-13 -- 2018-05-17},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-269991,

title = {CMOS-Compatible Semiconductor-Based Gas Sensors},

author = {Lado Filipovic},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2018/CP2018_Filipovic_2.pdf},

year  = {2018},

date = {2018-01-01},

booktitle = {Book of Abstracts of Emerging Technologies Communication Microsystems Optoelectronics Sensors},

note = {invited; Emerging Technologies Communication Microsystems Optoelectronics Sensing (ETCMOS), Whistler, British Columbia, Canada; 2018-05-09 -- 2018-05-11},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-270040,

title = {Unified Feature Scale Model for Etching in SF6 and Cl Plasma Chemistries},

author = {Xaver Klemenschits and Siegfried Selberherr and Lado Filipovic},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2018/CP2018_Klemenschits_2.pdf},

isbn = {978-1-5386-4810-0},

year  = {2018},

date = {2018-01-01},

booktitle = {Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)},

pages = {65--66},

note = {Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Granada, Spain; 2018-03-19 -- 2018-03-21},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-261148,

title = {Modeling Electromigration in Nanoscaled Copper Interconnects},

author = {Lado Filipovic and R. L. Orio and Wolfhard Zisser and Siegfried Selberherr},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2017/CP2017_Filipovic_01.pdf},

doi = {10.23919/SISPAD.2017.8085289},

isbn = {978-4-86348-612-6},

year  = {2017},

date = {2017-01-01},

booktitle = {Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

pages = {161--164},

note = {International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kamakura, Japan; 2017-09-07 -- 2017-09-09},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-260035,

title = {Numerical Aspects of the Deterministic Solution of the Wigner Equation},

author = {Johann Cervenka and Lado Filipovic},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2017/CP2017_Cervenka_1.pdf},

isbn = {978-3-200-05129-4},

year  = {2017},

date = {2017-01-01},

booktitle = {Book of Abstracts of the International Wigner Workshop (IW2)},

pages = {42--43},

publisher = {Institute for Microelectronics, TU Wien},

note = {International Wigner Workshop (IW2), Low Wood Bay, Lake District, UK; 2017-06-05},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-251400,

title = {Using One-Dimensional Radiosity to Model Neutral Flux in Convex High Aspect Ratio Structures},

author = {Paul Manstetten and Lado Filipovic and Andreas Hössinger and Josef Weinbub and Siegfried Selberherr},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2016/CP2016_Manstetten_1.pdf},

doi = {10.1109/SISPAD.2016.7605198},

isbn = {978-1-5090-0817-9},

year  = {2016},

date = {2016-01-01},

booktitle = {Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},

pages = {265--268},

note = {International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Nürnberg, Deutschland; 2016-09-06 -- 2016-09-08},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-249786,

title = {Effects of the Deposition Process Variation on the Performance of Open TSVs},

author = {Lado Filipovic and Siegfried Selberherr},

url = {http://www.iue.tuwien.ac.at/pdf/ib_2016/CP2016_Filipovic2.pdf},

doi = {10.1109/ECTC.2016.177},

isbn = {978-1-5090-1204-6},

year  = {2016},

date = {2016-01-01},

booktitle = {Proceedings of IEEE Electronic Components and Technology Conference (ECTC)},

pages = {2188--2195},

note = {IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA; 2016-05-31 -- 2016-06-03},

keywords = {},

pubstate = {published},

tppubtype = {inproceedings}

}